ABSTRACT
Polycrystalline silicon thin films were grown on silicon wafer substrate by using hot wire plasma enhanced chemical vapor deposition (HW-PECVD) system. 10% of silane (SiH4) gas diluted in hydrogen were used as gas sources. The effect of substrate temperature on their deposition rate, layer structures and electrical properties were analyzed trough the layer thickness, crystal structure and dark conductivity. The deposition rate varies from 8.95 A/s to 14.57 A/s for substrates temperature from 175C to 275 C at gas flow rates of 70 sccm and filament temperatures of 1000 C. Selengkapnya
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